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everlight electronics co.,ltd. technical data sheet high power led ? 3w ehp-b02/grb03-p03 everlight electronics co., ltd. http://www. everlight.com rev. 3.0 page: 1 of 11 device no. : dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou features z feature of the device: small package with high efficiency z typical view angle: 130. z typical green light flux output: 35 lm @ 350ma. z typical red light flux output: 25 lm @ 350ma. z typical blue light flux output: 8 lm @ 350ma. z esd protection. z soldering methods: smt. z grouping parameter: total luminous flux, dominant wavelength z the product itself will remain within rohs compliant version descriptions z the series are specially designed for applications requiring higher brightness. z led should mount onto the aluminum-cored printed circuit board z allowing for cooling. z thermal resistance r th,j-l = 9 o k/w applications z tft lcd display backlight z decorative and entertainment illumination z signal and symbol luminaries for orientation marker lights (e.g. steps, exit ways, etc.) z exterior and interior automotive illumination materials items description housing black body heat resistant polymer encapsulating resin silicone resin lens silicone electrodes ag plating copper alloy die attach silver paste chip algainp? red ingan? green ingan? blue
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 2 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou dimensions notes: 1. dimensions are in millimeters. 2. tolerances unless dimensions 0.25mm.
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 3 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou maximum ratings ( t ambient =25oc ) parameter symbol rating unit operating temperature t opr -40 ~ +85 oc storage temperature t stg -40 ~ +100 oc junction temperature t j 125 oc red 550 blue 500 pulse forward current green i f 500 ma power dissipation (under pulse) p d 5.0 w electro-optical characteristics ( t ambient =25oc ) parameter symbol color min. typ. max. unit condition r 23 ----- 33 b 6 ----- 13 luminous flux v g 33 ----- 45 lm viewing angle 2 1/2 ----- 130 ----- deg r 620 ----- 630 b7 460 ----- 465 wavelength d g2 525 ----- 530 nm r 2.05 ----- 2.65 b 3.25 ----- 3.85 forward voltage v f g 3.25 ----- 3.85 v i f =350ma note. 1. 2 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. luminous flux measurement tolerance : 10% 3. forward voltage measurement tolerance : 0.1v 4. wavelength measurement tolerance : 1nm
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 4 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou standard specification part number color bins brightness range(lm) ehp-b02/grb03-p03/g3rb7/tr g3 r5 r6 b7 g : 33-45 ; r : 23-33 ; b : 6-13
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 5 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou relative spectral distribution, i f =350ma, t ambient =25oc forward voltage vs forward current, t a m b i e n t =25oc relative luminous intensity vs forward current , t a m b i e n t =25oc 0 50 100 150 200 250 300 350 400 20 40 60 80 100 green red relative luminous intensity (%) forward current (ma) blue 0 100 200 300 400 500 2.0 2.4 2.8 3.2 3.6 4.0 vf ( v ) if (ma) g r b forward current derating curve, deratin g based on t j ma x =125c typical electro-optical characteristics curves 0 20 40 60 80 100 0 50 100 150 200 250 300 350 400 forward current (ma) ambient temperature ( o c ) 400 500 600 700 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intensity wavelength(nm)
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 6 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou -80-60-40-20 0 20406080 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 r b / g relative luminous intensity degree ( 2 ) typical representative spatial radiation pattern
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 7 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: luminous ranks hue: dominant wavelength ref: reference lot no: lot number made in taiwan: production place reel dimensions note: 1. dimensions are in millimeters 2. the tolerances unless mentioned is 0.1mm
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 8 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou 16.0 2.0 4.0 24.0 11.5 10.4 5. carrier tape dimensions: loaded quantity 300 pcs per reel . note: 1. dimensions are in millimeters 2. the tolerances unless mentioned is 0.1mm moisture resistant packaging aluminum moistue-proof bag label desiccant label
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 9 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 10 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou precautions for use 1. over-current-proof though ehp-b02 has conducted esd protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. otherwise slight voltage shift may cause enormous current change and burn out failure would happen. 2. storage i. do not open moisture proof bag before the products are ready to use. ii. before opening the package, the leds should be kept at 30 or less and 90%rh or less. iii. the leds should be used within a year. iv. after opening the package, the leds should be kept at 30 or less and 70%rh or less. v. the leds should be used within 168 hours (7 days) after opening the package. vi. if the moisture absorbent material (silicone gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. vii. pre-curing treatment : 605 for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliability, ehp-b02 series led package should be mounted on a metal core printed circuit board (mcpcb) with proper thermal connection to dissipate approximately 3w of thermal energy under 350ma(per die) operation. ii. special thermal designs are also recommended to take in outer heat sink design, such as fr4 pcb on aluminum with thermal vias or fpc on al uminum with thermal conductive adhesive, etc. iii. sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and led lifetime will decrease critically.
everlight electronics co.,ltd. ehp-b02/grb03-p03 everlight electronics co., ltd. http://www.everlight.com rev. 3.0 page: 11 of 11 device no.:dse-b02-002 prepared date: sep. 04, 2008 prepared by: brady chou 4. soldering condition i. lead reflow soldering temperature profile ii. reflow soldering should not be done more than two times. iii. while soldering, do not put stress on the leds during heating. iv. after soldering, do not warp the circuit board 5. soldering iron i. for prototype builds or small series production runs it is possible to place and solder the led by hand. ii. dispensing thermal conductive glue or grease on the substrates and follow its curing spec. press led housing to closely connect led and substrate. iii. it is recommended to hand solder the leads with a solder tip temperature of 280c for less than 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. iv. be careful because the damage of the product is often started at the time of the hand solder.

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